C10200 Oxygen-free Copper Bar

Product description：C10200 oxygen-free copper bar has good electrical and thermal conductivity, corrosion resistance and processing properties, it can be welded and brazed. Impurities containing low electrical and thermal conductivity are small, and trace oxygen has little effect on electrical conductivity, thermal conductivity and processing properties, but it is easy to cause "hydrogen disease" and is not easy to process (annealing, welding, etc.) in high temperature (>370℃) reducing atmosphere and use.

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Chemical Composition

％
Cu+Ag (min)	P	Ag	Bi	Sb	As	Fe	Ni	Pb	Sn	S	Zn	o
C10100	TU00	99.99	0.0003	0.0025	0.0001	0.0004	0.0005	0.001	0.001	0.0005	0.0002	0.0015	0.0001	0.0005
C10100	TU00	Te ≥0.0002. Se ≥0.0003. Mn ≥0.00005. Cd ≥0.0001
T10130	TU0	99.97	0.002	—	0.001	0.002	0.002	0.004	0.002	0.003	0.002	0.004	0.003	0.001
T10150	TU1	99.97	0.002	—	0.001	0.002	0.002	0.004	0.002	0.003	0.002	0.004	0.003	0.002
T10180	TU2	99.95	0.002	—	0.001	0.002	0.002	0.004	0.002	0.004	0.002	0.004	0.003	0.003
C10200	TU3	99.95	—	—	—	—	—	—	—	—	—	—	—	0.001
C1020		99.96(Only Cu）	—	—	—	—	—	—	—	—	—	—	—	—
CW008A	Cu-OF	99.95(Only Cu）			0.0005	0.005								0.03

Type	Grade	Shape	State	Dimension
				O.D.	Length (mm)
Extruded	C11000	Round	R	16-＜30	L500-5000
				30-300	OD≤50 L1000-5000 OD:50-75 L500-5000 OD＞75-120 L500-4000 OD＞120 L300-4000
		Rectangle		20-120
		Square, hexagonal		20-120
Drawing	C11000	Round	M, Y	6-80	OD≤50 L1000～500 OD＞50-80 L500～5000
		Square, hexagonal		8-60
		Square		8-60

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