1. Product Name: Lead-in Frame Copper Strip
Grade: C19210, C19400
Product Features
1. C19210
Tensile strength: 300-450Mpa; Hardness: HV 110-135; Conductivity > 85% IACS; High softening point: above 470 ° C; Good corrosion resistance; Expansion coefficient is matched with silicon wafer, ceramic or glass to ensure obtaining a hermetic package.
2, C19400
Tensile strength: 350-550Mpa; Hardness: HV120-160; Conductivity > 60% IACS; High softening point: above 470 ° C; Good corrosion resistance; Expansion coefficient matched with silicon wafer, ceramic or glass to ensure a hermetic package; good soldering performance.
Name | ASTM | EN | JIS | GB | Features | Application |
Lead-in Frame Copper Strip | C19210 | CuFe0.1P | KFC | QFe0.1 | Good cold working performance, medium strength and high conductivity, good electroplating, hot dip tin plating performance, very suitable for soldering and gas shielded welding. | Mainly used in integrated circuit, microelectronics, LED, computer and other industries, in the integrated circuit plays a supporting chip, connecting circuit and heat dissipation role, is the key components of integrated circuits. |
C19400 | CuFe2P | C194 | QFe2.5 | Good cold working performance, medium strength and medium conductivity, good electroplating performance, hot-dip tin plating performance, suitable for soldering and gas shielded welding. |
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